- Core Temp makes it easy for you to monitor the temperature of any modern x86 based processor. The program supports processors from all three major manufacturers; Intel, AMD and VIA.
- Add support for Intel® Server Board based on Intel® Xeon® Platinum 9200 processor f amily. Update System Event Sensor for BIOS/ Intel® ME OOB update and BIOS configuration change from BMC EWS. Add NVMe. Temperature sensor and NVMe Critical Warning sensor support. Add remote debug sensor support. Add system firmware security sensor support.
- Intel Cpu Temperature Monitor Mac
- Intel Cpu Temperature Sensor Problems
- Intel Cpu Temperature Monitor
- Intel Cpu Temperature Limits
As I write this and glance over at the HWiNFO64 Sensor Status display, the cores of my i7-2600k are usually idling at 1.6GHz, but change occasionally to the OC speed of 4.6GHz. My real CPU temp varies between 25C and 30C, while the ASUS CPU temp, that I can also see as I said, is showing 14C - 15C. Real Temp is another free CPU temperature monitor that shows you the real core temp of your processor. This lightweight tool is specifically developed to monitor the accurate temperature of Intel single Core, Dual Core, Quad-Core CPUs. It’s a free temp monitoring software for Windows PC.
- Windows*: Joe Olivas, Timo Kleimola, Mark Price, Timothy McKay
- MacOS*: Patrick Konsor
- Windows*: Seung-Woo Kim, Karthik Krishnan, Vardhan Dugar, Joseph Jin-Sung Lee, Jun De Vega
Intel® Power Gadget is a software-based power usage monitoring tool enabled for Intel® Core™ processors (from 2nd Generation up to 10th Generation Intel® Core™ processors). Intel® Atom™ processors are not supported. It is supported on Windows* and macOS* and includes an application, driver, and libraries to monitor and estimate real-time processor package power information in watts using the energy counters in the processor. With this release, we are providing functionality to evaluate power information on various platforms including notebooks, desktops and servers. Windows 7* and 32-bit versions of the Intel® Power Gadget for Windows* has ceased development from 3.0.7. Starting with version 3.5 and going forward, only the 64-bit version and Windows 8* will be supported.
Traditional methods to estimate power/energy usage of the processor has always been a cumbersome task that included special purpose tools or instrumentation on the platform along with third party equipment. The motivation for the tool was to assist end-users, ISV’s, OEM’s, developers, and others interested in a more precise estimation of power from a software level without any H/W instrumentation.
In version 3.0 there are additional features that include estimation of power on multi-socket systems as well as externally callable APIs to extract power information within sections of code. The multi-socket support essentially evaluates the Energy MSR on a per-socket basis and provides an estimate of power draw per socket. The API layer is a set of libraries and dlls that can be called and offers the flexibility to build the tool within code sections of an application. Latest release also includes support for Windows 10*.
Brief Description (Windows*)
Intel® Power Gadget 3.5 consists of the following components. Set of driver and libraries which access and post process the processor energy counter to calculate the power usage in Watts, temperate in Celsius and frequency in GHz (default install directory will be ~Program FilesIntelPower Gadget 3.5). A command line version of the tool (PowerLog3.0.exe) is also included
System Requirements (Windows*)
- Windows 8*
- Windows 10*
- Windows Server 2008, Windows Server 2012
- Microsoft .NET* Framework 4
- Microsoft Visual C++ 2017 Redistributable package
- 2nd Generation Intel® Core™ Processor or later, older processors not supported
- Single socket
System Requirements (macOS*)
- macOS* 10.11 or later
- 2nd Generation Intel® Core™ processor or later
Known Limitations / Issues
- Graphs will not appear if your processor does not have the appropriate hardware counters
- Discrete graphics cards are not supported and GPU graphs will not appear unless Intel graphics is in use
- Windows 7* supported builds are below in the Archive section
Installation / Setup (Windows*)
- Run the msi package as an administrator. Accept the UAC, if one appears
- Follow the installer prompt instructions to complete installation
- .Net Framework 4 (will automatically be downloaded from Microsoft* site if not yet installed in your system) needs Internet connection
- Microsoft* Visual C++ 2017 Redistributable Package (will automatically get installed if not yet installed)
Installation / Setup (macOS*)
- Double click the downloaded DMG (Intel Power Gadget.dmg)
- Double click the package (Install Intel Power Gadget.pkg)
- Follow the installer prompt instructions to complete installation
On recent macOS versions, after installation users need to explicitly allow the Power Gadget driver to load:
- Open System Preferences, and click on 'Security and Privacy'
- Click the lock at the bottom of the page to unlock changes
- Click 'Allow' to allow system software from Intel Corporation:
- Restart your computer to apply the changes
On macOS Catalina (10.15), users may need to perform additional steps to enable the Power Gadget driver to automatically load (this is due to a bug in macOS).
- Open the Terminal application
- Enter the following command, and press Enter (requires a password to complete):
- Restart your computer to apply the changes
Common use of Intel® Power Gadget is to monitor energy usage of the processor
- Provides processor power (Watts), temperature (Celsius) and frequency (MHz) in real-time via graph displayed in the GUI
- Let you log the power and frequency measurements and save it in a csv format.
- Double click on the desktop shortcut and the GUI will launch
- Drag to move the GUI.
- Right click the GUI and a pop-up menu will show up allowing you to choose options or close the application. Options have the following parameters. Click “Start Log” button in the GUI to start logging. Press the same button “Stop Log” to stop logging. While it’s logging, red label “REC” will blink in the power chart area.
- You can choose to add time-stamp to the log file name or not.
- You can choose the log file name.
- You can choose to resize the GUI from 100% to 300% by dragging the slider and testing the new size with the “Apply Size” button and accept the changes by pressing “Ok”.
- Screen Update Resolution lets you change how often the GUI is updated at runtime. This may range from 50 ms to 1000 ms. (Default set to 1000 ms)
- Log Sampling Resolution lets you change the logging sampling resolution ranging from 1 ms to 1000 ms. (Default set to 100 ms)
- In a multi-socket system, you can choose which package information to display in the GUI. The log will record all package information in a csv file.
- Click 'Start Log' button in the GUI to start logging. Press the same button 'Stop Log' to stop logging. While it's logging, red label 'REC' will blink in the power chart area
Using Intel® Power Gadget 3.0 in a Script
In order to start and stop the logging in a script, first launch the GUI as usual.
- At the beginning of the script, call 'IntelPowerGadget.exe -start' and it will trigger the logging in the GUI.
- At the end of the script, call “IntelPowerGadget.exe -stop” and it will stop the logging.
The parameters for the log are based on the options set in the GUI.
PowerLog3.0.exe is the command line version of Intel® Power Gadget in logging power usage
- Log power data to logfile for a period of time:
- Start a command a log power data to logfile until the command finish:
Logfile will include the elapsed timed, package power limit, processor frequency, GT frequency, processor temperature, average and cumulative power of the processor
- Processor Energy (Total energy of the processor) = IA Energy + GT Energy (if applicable) + Others (not measured)
- IA Energy (Energy of the CPU/processor cores)
- GT Energy (Energy of the processor graphics) – If applicable , some processors for desktops and servers don’t have it or may have use discrete graphics
Only works on 2nd Generation Intel® Core™ processor family or newer. Atom processors not yet supported.
Use only 32-bit installer for 32-bit OS and 64-bit installer for 64-bit OS
Application may hang after running for a long period of time (just close and restart application)
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
This document contains information on products in the design phase of development.
All products, platforms, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. All dates specified are target dates, are provided for planning purposes only and are subject to change.
This document contains information on products in the design phase of development. Do not finalize a design with this information. Joomla 3.10. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design.
Code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2019, Intel Corporation. All rights reserved.
Intel® Power Gadget also provides a C/C++ Application Programming Interface (API) for accessing this power and frequency data in your program; the API is supported on Windows and Mac OS X. For more information on the API's, see:
For Mac Using the Intel® Power Gadget API on Mac OS X
For Windows Using the Intel® Power Gadget API on Windows
End User License Agreement included in Windows* download
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel Cpu Temperature Monitor Mac
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked 'reserved' or 'undefined.' Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Silicon Temperature Sensors
Silicon sensors are becoming increasingly important transducers in electronic systems. As systems become more complex, more compact, and denser-and run faster and hotter-it becomes increasingly vital to monitor critical temperatures. Traditional sensor techniques, such as thermocouples, thermistors, and RTDs, are now being displaced by silicon sensors, with their ease of integration and use. Many traditional sensor types are inherently nonlinear and require signal conditioning (i.e., compensation, look up tables, excitation circuitry, etc.) to accurately convert temperature into an electrically measurable quantity such as voltage or current.*
*Practical examples of signal-conditioning considerations, designs, and circuits can be seen in the seminar notes, Practical Design Techniques for Power and Thermal Management, Section 6.
Silicon sensors, on the other hand, are linear, accurate, low-cost, and can be integrated on the same IC as amplifiers and any other required processing functions. The actual sensing element in a silicon sensor is a simple P-N transistor junction. The voltage across a regular P-N transistor junction has an inherent temperature dependency of about 2 mV/°C and this fact may be used to develop a temperature measuring system. Silicon sensors are new by sensor-industry standards but are very mature by semiconductor-industry standards. For example, the AD590 1-µA/°C IC sensor was introduced more than 20 years ago!†
†Analog Dialogue 12-1, 1978, pp. 3-5. See also M. P. Timko, 'A two-terminal IC temperature transducer,' IEEE Journal of Solid-State Circuits, vol. SC-11, 1976, pp. 784-788.
In order to separate the variation with temperature from the effect of current level and remove offsets, the most common technique is to base the measurement on two transistor junctions. By operating two identical transistors at a constant ratio of collector current densities, r, the difference in their base-emitter voltages will be (kT/q) (ln r). Since both k (Boltzmann's constant) and q (electron charge) are physical constants, the resulting voltage is directly proportional to absolute temperature, T (PTAT).
Temperature-monitoring products available from ADI, which incorporate this type of temperature sensing, usually integrate it with additional functionality. For example, it may be combined with analog-to-digital conversion circuitry. Figure 1 shows a block diagram of the AD7415; it contains temperature-sensing circuitry, an amplifier, and an ADC, along with a two-wire I2C interface. Other products, such as the ADM9240, which was featured in Analog Dialogue 33-1, include many additional functions, such as voltage monitoring and fan-speed monitoring, as well as on-chip limit setting.
Sensor Mounting Considerations–THE PROBLEM
While a silicon sensor is a very accurate temperature transducer, it is important to remember that it will only measure its own junction temperature, and thus its own die temperature. This is fine if one is simply interested in monitoring approximate zone temperatures within an enclosure or environmental temperature (and convection and conduction conditions are adequate). If, however, one must monitor the local temperature within a heat source or a computer chip, such as a Pentium® III CPU, or a high performance graphics chip, much more is at stake and the situation is not quite so straightforward. In order to get an accurate measure of the temperature of the heat source, the sensor must be in close proximity to the source itself. The accumulation of thermal resistances between the sensor and heat source will lead to measurement errors and uncertainties. The physical mounting problems required to be solved in order to get accurate temperature measurement may be simply impossible to deal with in many situations, resulting in derating and suboptimal performance.
For example, if IC temperature sensors had to be mounted on the circuit board, it is very unlikely that they could be in close physical contact with the 'hot spot' of the object being monitored. It might be possible to work around the mounting difficulties with tiny two and three terminal devices, but with multi-lead packages it is virtually impossible.
One approach might be to add a well-chosen offset to account for the temperature difference between the sensor and the heat source. The required offset can be derived during system characterization by comparing the displayed temperature with the actual temperature. Since the offset needed at room temperature will almost certainly be different from the offset required at elevated temperatures, a simple offset register is generally not enough. A lookup-table approach is one way of working around the problem. This approach might be effective, albeit unwieldy, for a fixed system, but the look up tables would differ when the system configuration changes.
For example, consider trying to measure the temperature of a CPU on a motherboard by placing a temperature sensor as closely as possible to the CPU. The sensor will most likely be at least 1 cm away from the heat source (CPU). The thermal resistance of the path through the board material between the two is very high, and air currents (i.e., convection or fan-driven flow if directed from source toward sensor) is the principal way in which the heat is transferred to the sensing junction. Convection currents alone are easily disturbed-for example, by adding another card to the system-leading to measurement inaccuracies. Fan-driven flow has its advantages for cooling, but will distort the convection currents and result in wildly inaccurate measurements of local temperature within the CPU chip.
The ideal solution is to integrate the sensor and associated conditioning circuitry on the CPU die itself. This integration would guarantee accurate temperature sensing since the sensor would be in close physical as well as thermal proximity to the heat source. Unfortunately the technology used to build today's high performance CPUs is not compatible with the technology used to build highly accurate temperature sensors and associated amplification circuitry.
The Answer: Sense the CPU Directly
The best approach to the problem is to provide P-N-junction sensing on the CPU die near the hot spot(s)-and then use an external conditioning IC to do the rest. This approach allows CPU temperatures to be directly measured without any uncertainty. The newest Intel Pentium® II and Pentium® III CPU's contain an on-chip thermal diode monitor (TDM) to facilitate this. On Slot 1 CPUs, two pins, THERMDP and THERMDN, provide access to the on-chip diode. To supply signal conditioning and convert the minute voltage changes into robust measurable results in digital form, a new generation of products from Analog Devices, the ADM102x series, supply the required conditioning and conversion circuitry.
TDM to Digital–A New Approach
The trick is now to translate the minute voltage changes due to temperature into really measurable signals and digitize them. The low signal levels would by themselves pose a difficult instrumentation problem, but it is further complicated by the noisy environment that the circuit must operate in. Picture if you will the electrical environment within a digital computer chip! The signal could very easily be swamped by the noise making it impossible to recover the signal. Also, manufacturing variations from unit to unit cause differences in junction response. We will now discuss how the technique works, how it compares with more traditional techniques and how to extract optimum performance from it.
Intel Cpu Temperature Sensor Problems
First, for a given current level, the absolute forward voltage drop of the diode isn't very well controlled in the CPU manufacturing process. Also, because voltage depends on absolute (i.e., Kelvin) temperature, the forward voltage value is many times larger than the change in its value per 1°C temperature change. Therefore, the most important requirement is to remove the absolute value of the diode voltage from the equation before any amplification can occur.
Individual device calibration is an option but not a practical one. Rather, a technique comparable to the two-transistor approach described above is used, except that the ratio of current density (current per unit area), r, depends on changing the current in the same diode instead of using the differing areas of two diodes with equal currents. This technique, called 'delta-VBE calibration,' forces two different levels of current through the thermal diode junction and measures the change in forward voltage. The first current may be considered as a calibration current and the VBE forward voltage value of the junction is ascertained. The VBE value is then measured again with a second current. The change or difference in VBE is proportional to absolute temperature. It is independent of the junction's forward voltage or other differences due to manufacturing variations.
VBE= (kT/q) ln (Ic/Is)
Since IS is a property of the transistor and is unchanged for either current,
VBE1-VBE2 = ΔVBE = (kT/q) ln (I/NI) = (kT/q) ln (1/N)
Since N, k, and q are all known constants,
T = (Constant) (ΔVBE)
The output from the ΔVBE sensor varies at approximately 2.2 mV/°C. This signal requires conditioning and amplification The actual ΔVBE sensor is shown as a substrate transistor since this would be the case in practice for an on-chip junction. It could equally well be a discrete transistor. If a discrete transistor is used, the collector will not be grounded and should be linked to the base. To help prevent ground noise from interfering with the measurement, the more negative terminal of the sensor is not referenced to ground, but is biased above ground by an internal diode at the D- input. To measure ΔVBE, the sensor is switched between operating currents of I and N × I.
Filtering and Amplifying
The resulting waveform is passed through a 65-kHz low-pass filter to remove noise, then to a chopper-stabilized amplifier that performs the functions of amplification and rectification of the waveform to produce a dc voltage proportional to ΔVBE. This voltage is measured by the ADC to give a temperature output in 8-bit twos-complement format. To further reduce the effects of noise, 16 measurements are made, the results are averaged, and the average result is then provided at the output.
So how good is the TDM approach in practice?
It is interesting to compare a TDM measurement with a more traditional thermistor approach. The following example compares results obtained using a thermistor and a TDM channel to measure the temperature of a 333-MHz Pentium® II in a Slot 1 cartridge. The thermistor is in direct physical contact with the cartridge heatsink. The TDM channel uses the on-chip diode and an ADM1021 (with circuitry similar to those discussed above) to provide the signal conditioning.
Besides being more accurate, it does not suffer from thermal lag. While contact with the heat sink is superior to earlier approaches where contact was not even made, it still exhibits major disadvantages. As may be seen in Figure 4c the thermistor lag completely misses many of the thermal events due to it's slow response time. Figure 4a shows a power up event while Figure 4b shows a power-down. Errors in excess of 30°C (representing cartridge temperature instead of actual chip temperature) are evident.
Even more significant is Figure 4c where the CPU is cycled in and out of Suspend mode. The thermistor completely misses these 20°C thermal events. It's easy to see how it would fail to protect a system in the event of a rapid temperature rise due to a fault condition. All plots also demonstrate the offset error (due to package temperature drop) between the TDM and the thermistor as the temperature increases. The offset can be taken care of by system calibration but there is nothing one can do to compensate for thermal lag. Indeed if additional system cooling were employed, the errors between the TDM and the thermistor would be greater still.
Using Discrete transistors for TDM
So the TDM approach is very effective if the sensing diode is integrated onto the die of the CPU whose temperature is being measured. What about using this approach to measure temperatures where there isn't an on-chip TDM, or to measure the temperature of heat sources other than IC's? The ΔVBE TDM approach may also be used with stand-alone discrete transistors. Any NPN or PNP general-purpose transistor, such as 2N3904 or 2N3906, may be used as a remote sensor. With a discrete transistor, connect the base to the collector to form a 2-terminal device. Transistors are good temperature sensors since they have low thermal mass and are easily mounted.
If the transistor sensing junction is a significant distance away (>6 feet) and if it is used in noisy environments, the best method to preserve signal integrity and prevent interference is to use twisted shielded cable. The maximum cable length is limited by cable capacitance and by series resistance. Capacitance between D+ and D- causes settling time errors since the switched current needs to have fully settled before the conversion is made.
TDM in Noisy Environments
It is very important to observe some guidelines when utilizing thermal diode sensing techniques, especially in noisy environments. The PC environment is inherently noisy and appears to be getting noisier as PCs get faster. As CPU speeds hurl towards 1 GHz, EMC noise becomes more of a headache. High speed graphics ports (AGP), high speed random-access memory, and high speed disk access mean that there are many opportunities and paths for noise to couple into sensitive analog circuitry. TDM is a very sensitive approach. The circuitry that drives the thermal diode consists of high-impedance, low-level current sources. To prevent interference, the TDM lines should be kept as short as possible and shielded if there are high frequency noise sources in the vicinity.
Additional features on the ADM1021
In addition to the TDM channel, the ADM1021 includes an on-chip transistor for local or environmental temperature monitoring. A programmable conversion rate (from 1 conversion per 16 seconds up to 8 conversions per second) facilitates high update rates, where rapid temperature changes must be recorded. If fast updates are not required, then lower update rates may be used to conserve power.
The ADM1021 also contains four limit registers to store local and remote, high and low temperature limits. A functional block diagram is shown in Figure 7 A typical system configuration using the ADM1021 is illustrated in Figure 8.
TDM CPU monitoring facilitates optimum cooling
Intel Cpu Temperature Monitor
A thermal profile of a real-life notebook computer is illustrated in Figure 9. This shows how the temperature ramps up on the chip and in the computer environment once the monitoring utility starts running (after power-on and Windows boot). It is interesting to note how hot both the CPU and the internal environment are running. The BIOS sets a CPU temperature limit of 92°C. When this temperature is reached, the fan is switched on and remains on until the temperature drops below 82°C. Because both high and low limits are programmed into the ADM1021, the fan can control the CPU temperature within a band between 82°C and 92°C. The temperature will oscillate between these two levels. If the fan fails, a higher temperature limit will shut the system down if it is breached. It is also interesting to note that the environment temperature also reaches very high temperatures, approximately 10ºC below the CPU temperature, within a notebook housing.
Intel Cpu Temperature Limits
This example illustrates the importance of TDM techniques in CPU temperature management. Prior to this technique, it would have been impossible to extract such high performance levels from the CPU without overheating-or unduly wasting battery life by continuously cooling the system.